• CIRCUPOSIT™ 6530 catalyst process for electroless copper ...

    This paper describes the development of a new ionic palladium catalyst, CIRCUPOSIT™6530 Catalyst, along with a tartratebased horizontal electroless copper bath, CIRCUPOSIT™6550, to meet the performance demands of highdensityinterconnect (HDI) and packaging (PKG) substrates in horizontal electroless copper plating.

    Get Price
  • Desmear and metallization Atotech

    Desmear and metallization Integrated wet chemical solutions for all key market segments including IC substrates, HDI/MLB and Flex/FlexRigid. Quick facts. ... Universal high throw horizontal electroless Copper. Process for advanced dielectrics including 5G and flex applications.

    Get Price
  • Atotech Introduces Printoganth RA Electroless Copper Process

    Printoganth RA horizontal electroless copper process was developed to ensure blisterfree electroless copper deposition and shiny surface appearance after electrolytic copper plating. Is compatible with electrodeposited copper (ED), rolled and annealed (RA) and “superflexible RA” (HA) copper foils.

    Get Price
  • Milestones in horizontal plating: a brief look at the ...

    1991 saw the introduction of horizontal electroless copper systems. Based on the total installed capacity per country, Taiwan could be called the center of horizontal plating. Taiwanese PCB makers have installed about 50 lines, and horizontal plating is the technology of choice of almost all top Taiwanese PCB shops.

    Get Price
  • The next revolution in electroless copper for advanced ...

    Berlin, September 3, 2018: Atotech introduces a new horizontal electroless copper process specifically developed to ensure a blisterfree electroless copper deposition and shiny surface appearance after electrolytic copper plating. The new process, Printoganth® RA, is compatible with electrodeposited copper (ED), rolled and annealed (RA) as ...

    Get Price
  • PTH horizontal / Plating horizontal | Hofstetter PCB Plating

    PTH horizontal / Plating horizontal. The electrolytic copper plating takes place in a horizontal plant, the Segmenta. This plant operates with pulse plating, achieving very good copper distribution on the surface. Outstanding results are achieved with the copper plating of blind microvias using special flooding elements.

    Get Price
  • Dow Electronic Materials Interconnect Technologies Product ...

    Electroless Copper (Vertical) 5 Electroless Copper (Horizontal) 5 Direct Plate (PalladiumBased) 5 Direct Plate (GraphiteBased) 5 PWB Metallization Electrolytic Plating 6 Alkaline Cleaner 6 MicroEtchant 6 Acid Cleaners 6 Acid Copper (Vertical) 6 Acid Copper (Horizontal) 6 Acid Copper (Pulse) 6 Acid Copper (Via Fill) 6

    Get Price
  • CIRCUPOSIT™ 4000 Electroless Copper Plate | Self ...

    CIRCUPOSIT™ 4500 ELECTROLESS COPPER is a selfaccelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications.

    Get Price
  • Horizontal Electroless Copper System Line Plating Machine

    A new marketsized Horizontal Electroless Copper Processing System designated the Model 990D is just 41′ long and 71″ wide, the system is designed to fit the needs of …

    Get Price
  • Room temperature electroless plating copper seed layer ...

    Uniform electroless copper films have previously been produced by employing 1 h deposition times [7]. In this paper, we report on the development of a plating process that results in a flash electroless copper seed layer process for submicron CMOS processing applications. Fig. 2 shows a SEM of a horizontal feature on a patterned

    Get Price
  • Printed Circuit Board (PCB) Chemicals | RBP Chemical ...

    A room temperature, conventional speed, electroless copper process which will deposit a dense, adherent copper … electronicschemicals throughholeplating electroless: CIRCUTEK™ PC701: High Speed Electroless Copper Process: A high speed, electroless copper process which is capable of depositing 80 – 100 millionths …

    Get Price
  • Horizontal Electroless Copper PCB Shop

    Horizontal Electroless Copper . Model: Printoganth SAP Plus, U, U Plus, P Plus. Category: Materials and Chemicals for PCB / Chemicals for PCB / Alkaline Palladium Base ElectroLess Copper Process Characteristics . Printoganth SAP Plus process chemistry in combination with Uniplate equipment gives superior adhesion on bare resins coupled with an extremely good surface distribution. This makes ...

    Get Price
  • REPRINTED WITH PERMISSION FROM CIRCUPOSIT™ 6530 …

    horizontal electroless copper bath, CIRCUPOSIT™ 6550, to meet the performance demands of highdensityinterconnect (HDI) and packaging (PKG) substrates in horizontal electroless copper plating. Implementation of the new ionic catalyst process is demonstrated through excellent coverage and reliability performance of through

    Get Price
  • Electroless Plating Catalyst Performance of a Cationic ...

    Electroless Plating Catalyst Performance of a Cationic Moiety Bearing Palladium Complex. ... along with a tartratebased horizontal electroless copper bath, CIRCUPOSIT™6550, to meet the ...

    Get Price
  • CIRCUPOSIT 6500 Horizontal Electroless Copper Process for ...

    To meet these challenges, Dow has created the CIRCUPOSIT 6500 Horizontal Electroless Copper System, based on an Ionic Catalyst and a Tartratebased Electroless copper for ELIC and IC Substrate applications. Key Features of the process:

    Get Price
  • Chapter Electroless Copper In Printed Wiring Board …

    Electroless Copper in Printed Wiring Board Fabrication 337 The classical steps of pretreatment will now be taken in sequence. Cleaning The first step in any pretreatment line is to clean the entire compositethe laminated copper and the pierced dielectric material. The cleaner is typically

    Get Price